Canon Patent Application: Curved Sensor manufacturing

In this patent application, Canon is attempting to patent a method of manufacturing for a curved sensor.

In the main description, Canon is generically describing curving a semiconductor with two layers (ie: what we call stacked).  Later on in the description, what this semiconductor becomes clearer as Canon states;

 In this specification, the upper main surface in FIG. 1B is referred to as a front surface 39, and the lower main surface opposite to the surface 39 is referred to as a back surface 40. In the present embodiment, the semiconductor element 11 is disposed on the surface 39 side of the semiconductor substrate 10. In addition, a color filter CF and a microlens ML are disposed on the semiconductor element 11. For example, the semiconductor element 11 may be a photoelectric conversion element such as a photodiode formed on the semiconductor substrate 10. Further, a semiconductor element such as a transistor for taking out a signal converted from light by the photoelectric conversion element may be disposed on the back surface 40 side of the semiconductor element 11 which is a photoelectric conversion element in the semiconductor substrate 10. That is, the semiconductor substrate 10 including the semiconductor element 11 may be a so-called back-illuminated imaging element. 

From this we see that Canon is looking at a BSI stacked sensor that curves.

Canon does go on to state, but really for the protection of the patent more than anything (because the applications where you'd curve a semiconductor are pretty rare);

However, the semiconductor device 1 is not limited to the imaging device

The rest of the patent goes through the process on how Canon is warping (or curving the sensor), essentially they are using a resin that expands as it cures, to deform the sensor.