Canon Patent Application: Another stacked image sensor patent

Canon over the past years that I've been delving deeply into patent applications have done a lot of work on stacked sensors.  I'm not sure where they are eventually thinking of these sensors ending up, it could be more industrial or automative applications - but the work is certainly continuing.

This patent application deals with further cost refinement, and also shows a different style of interconnect between the substrates than what Canon atypically illustrates.

What they are attempting to do is to reduce the costs associated with adding bypass capacitors into the sensor.

Recently, a solid-state imaging device has been proposed that by stacking a plurality of semiconductor components. The solid-state imaging device described in Patent Document 1 includes a plurality of stacked components, the first component is provided with a pixel portion, and the second component is provided with a read-out portion for reading out a signal from the pixel portion. .. In addition to the first component and the second component, a component dedicated to the bypass capacitor is further laminated.

However, the solid described in Patent Document 1 In the image pickup device, a component dedicated to the bypass capacitor has to be laminated, which causes a problem that the manufacturing cost increases. The   present invention has been made in view of the above problems, and it is an object of the present invention to efficiently arrange a capacitance portion while suppressing an increase in manufacturing cost. 

Japan Patent Application 2020-141397

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